Halogen free PI reinforcing plate is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement.
·产品结构及系列Product Structure and Series
产品结构 Product structure | 产品系列 Product serides |
Pi膜 PI Film 环氧树脂 Adhesive 离型纸 Release Paper | 环氧胶系列 Epoxy series |
·产品规格 Product Specifications
Item（项目） | Test method（测试方法） | Specification（规格） |
Width（幅宽） | Specification | 250±1mm |
PI stifferner film thickness（PI厚度） | Specification | 3-9 mil |
Adhesive thickness（胶层厚度） | Specification | 25±3um |
Shelf life（保质期） | 25±10℃，65±20﹪RH | 12months |
·产品性能 Product Properties
Item（项目） | Test method（测试方法） | Specification（规格） | |
Adhesive flow(溢胶量) | IPC TM650 2.3.17.1 | ≦0.2mm | |
Peel strength （剥离强度） | As Received（直接测试） | IPC TM650 2.4.9 | ≧0.8kgf/cm |
After MEK/10min (丁酮浸泡10分钟测试) | ≧0.8kgf/cm | ||
Solder Float Resistance（耐焊性） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小时后) | IPC TM650 2.4.13 | 288℃ 10sec | |
Surface Resistivity（Ω）(表面电阻率) Volume Resistivity（Ω.cm）(体积电阻率) | IPC TM650 2.5.17 IPC TM650 2.5.17 | ≧1.0*1013Ω | |
≧1.0*1015Ω.cm | |||
Insulation Resistance（Ω）(感应电阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | |
·产品应用 Product Application
用于插拔金手指等部位补强。
The product is mainly used to reinforce parts such as gold finger.