Epoxy resin PI film based FCCL is composed of three kinds of materials, copper foil, adhesive and PI film, which are compounded by high precision coating technology. With high temperature resistance, high insulation, high flexibility and other characteristics. Widely used in FPC manufacturing.
·产品结构及系列Product Structure and Series
产品结构 Product structure | 产品系列 Product serides | |
铜箔 Copper Foil 环氧树脂 Adhesive Pi膜 PI Film 单面基板 Single-side FCCL | 铜箔 Copper Foil 环氧树脂 Adhesive Pi膜 PI Film 环氧树脂 Adhesive 铜箔 Copper Foil 双面基板 Double-side FCCL | 高挠曲系列 |
LED 系列 | ||
BGA系列 | ||
·产品规格 Product Specifications
Item（项目） | Test method（测试方法） | Specification（规格） |
Width（幅宽） | Specification | 250±1mm |
Polyimide thickness（PI厚度） | Specification | 12.5um、25um |
Adhesive thickness（胶层厚度） | Specification | 13-25um |
Copper thickness（铜箔厚度） | Specification | 12.5um、18um、35um |
Shelf life(保质期) | 25±10℃，65±20﹪RH | 12months |
·产品性能 Product Properties
Item（项目） | Test method（测试方法） | Specification（规格） | ||
Peel strength （剥离强度） | As Received（直接测试） | IPC TM650 2.4.9 | ≧0.8kgf/cm | |
After MEK/10min (丁酮浸泡10分钟测试) | ≧0.8kgf/cm | |||
Solder Float Resistance（耐焊性） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小时后) | IPC TM650 2.4.13 | 288℃ 10sec | ||
Dimensional stability（尺寸稳定性） | IPC TM650 2.2.4 | TD≦±0.2% | ||
MD≦±0.2% | ||||
Chemical resistance （耐化学品性） | MEK 5min（丁酮浸泡5分钟测试） | IPC TM650 2.3.2 | No evident of defects | |
HCl 5% 5min（5%盐酸溶液浸泡5分钟测试） | ||||
NaOH 5% 5min（5%氢氧化钠溶液浸泡5分钟测试） | ||||
Surface Resistivity（Ω）(表面电阻率) | IPC TM650 2.5.17 | ≧1.0*1013Ω | ||
Volume Resistivity（Ω.cm）(体积电阻率) | IPC TM650 2.5.17 | ≧1.0*1015Ω.cm | ||
Insulation Resistance（Ω）(感应电阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | ||
·产品应用 Product Application
该系列产品广泛应用于FPC制造。
This series of products are widely used in FPC manufacturing.